TI and DoCoMo to develop single-chip 3G products

IDG News Service |  Mobile & Wireless

Texas Instruments Inc. and NTT DoCoMo Inc. plan to jointly develop a single-chip product for mobile phones based on third-generation (3G) technology, the companies announced Tuesday.

The future product will combine TI's latest OMAP2 applications processors with DoCoMo's WCDMA/UMTS (Wideband Code Division Multiple Access/Universal Mobile Telecommunications System) modem technology, said Jim Koutras, senior worldwide marketing manager for TI.

NTT DoCoMo said it will provide around

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