Micron to lay off as many as 2,000 in Boise
Micron Technology will lay off as many as 2,000 additional people as demand for DRAM products continues to decline.
Micron plans to phase out 200-millimeter wafer manufacturing operations at its Boise, Idaho, facility. That will initially result in layoffs of 500 employees, but as many as 2,000 people could lose their jobs by the end of Micron's fiscal year, the company said.
In a statement, Micron Chairman and CEO Steve Appleton said that he had hoped that demand for 200mm speciality DRAM products would have stabilized and started to improve, but that hasn't happened.
The layoffs are in addition to cuts to 15 percent of Micron's global workforce, announced in October.
The company will continue to operate its 300mm research and development fab facility and do work including product design, quality assurance and system integration in Boise.
Micron expects to take a cash restructuring charge of about US$50 million and realize a gross annualized operating cash benefit of $150 million.
IDG News Service
Sign up for ITworld's Daily newsletter
Follow ITworld on Twitter @IT_world
On Twitter now
micron technology
Powered by Twitter
jfruh
Apple syncing patent can't come soon enough
pasmith
New Twitter features borrow from 3rd party clients
Esther Schindler
Open Source Changes the Software Acquisition Process
mikelgan
How to set up continuous podcast play on the new iTunes
David Strom
Five important Windows 7 mobility features
sjvn
Guard your Wi-Fi for your own sake
Sandra Henry-Stocker
Grepping on Whole Words
Sidekick: The Good News & the Bad News
Either way you look at it Microsoft Data Center management did not follow standards or best practices in this failure. In which case it makes me wonder more about the outsourcing of corporate data much less personal data.
- mburton325
Join the conversation here
Quick, practical advice for IT pros. Made fresh daily.
Want to cash in on your IT savvy? Send your tip to tips@itworld.com. If we post it, we'll send you a $25 Amazon e-gift card.












