The chassis uses a slew of new networking and fabric technologies to deliver the improved bandwidth. The larger pipe shuttles data faster and also helps balance workloads more effectively in data centers to ensure servers aren't overloaded, Gromala said. The new chassis also provides for more storage bandwidth compared to its predecessor.
The enclosure also provides 3-D imaging capabilities of racks in a data center, Gromala said. The HP Systems Insight Manager server management software will be able to identify the location of a rack, which helps control various operations. It tracks IT assets and effectively manage and maintain systems, and saves hours of manual tagging of servers. It also helps improve power management and capping of servers in a data center.
"We can even track down the power topology," Gromala said.
The HP ProLiant WS460c Gen 8 blade is priced starting at US$5,037, while HP BladeSystem c7000 Platinum enclosure will be priced starting at $4,999. Both products will be available worldwide next month.