Qualcomm to pay Broadcom US$891 million in patent settlement

By Dan Nystedt, IDG News Service |  Legal, Broadcom, patent Add a new comment

Qualcomm, the world's largest maker of mobile phone chips, agreed to pay chip designer Broadcom US$891 million to settle a long running patent dispute to end all courtroom proceedings globally.

The agreement ends litigation in the U.S., the E.U. and Korea and gives each company the right to use the other's patent portfolio for four years, they said in a statement.

Qualcomm will make its first payment of $200 million by the end of June.

The settlement ends a dispute in which Qualcomm had lost at least one court case and saw its market threatened by a U.S. International Trade Commission ban on the import of new mobile phones and PDAs in mid-2007 that contained disputed Qualcomm chips.

The companies said some of the terms of the settlement were not disclosed.

    Add a comment

    Post a comment using one of these accounts
    Or join now
    At least 6 characters

    Note: Comment will appear soon after you have activated your account.
    Obscene/spam comments will be removed and accounts suspended.
    The information you submit is subject to our Privacy Policy and Terms of Service.

    ITworld LIVE

    Ask a question

    Ask a Question